The Chomerics division of Parker Hannifin Corporation will present a trio of new thermal interface materials at electronica 2024, staged on November 12-15 in Munich, Germany.

Exhibiting at booth B3.236, the innovations on show will include new thermal, cure-in-place, gap-pad and dispensable gel products. The company is also planning to announce the launch of a rapid sampling and prototyping service.

The THERM-A-FORM CIP 60 cure-in-place material and thermal gap filler provides thermal conductivity of 6 W/m-K. This two-component material delivers an exceptional flow rate and meets high-volume dispensing requirements, Parker Chomerics said.

Applications include e-mobility systems, automotive infotainment, advanced driver assistance systems (ADAS), and consumer and enterprise solid-state drives (SSDs).

The THERM-A-GAP 80LO high-performance, thermal gap pad offers very low oil-bleed and migration characteristics. It offers thermal conductivity of 8 W/m-K. A compressible, thermal elastomer, it conducts heat in the gaps between a heat-generating surface, such as a semiconductor or battery, and a heat-dissipating surface.

The gap pad minimises stress on components such as integrated circuits and provides physical protection such as vibration damping. Applications include GPUs, CPUs and memory modules, and 5G and telecoms equipment.

The THERM-A-GAPGEL 75VT high-performance, dispensable, thermal gel offers 7.5 W/m-K thermal conductivity and vertical tackiness for use in demanding, mission-critical applications. In long-term reliability tests, the new material passed automotive vertical-slump tests, high-vibration tests and telecoms thermal-material verification processes.

The single-component gel is suitable for use in automotive sensors and devices, telecoms modules, battery and energy storage system (BESS) modules, industrial electronics, network and IT infrastructure, power electronics and consumer electronics. Users can dispense the thermal gel at bond-line thicknesses up to 4 mm.

Parker Chomerics will also showcase its new rapid sampling and prototyping facility, located in the Czech Republic.