The Chomerics division of Parker Hannifin Corporation has introduced the THERM-A-GAP PAD 80LO, a high-performance thermal gap pad with low oil-bleed and migration.

The RoHS-compliant pad features a high-tack surface that reduces contact resistance, an operating temperature of -50 C to 200 C and a UL 94 V-0 flammability rating. It is also electrically isolating.

With a typical thermal conductivity of 8 W/m-K, the compressible thermal elastomer conducts heat in the gaps between a heat-generating surface, such as a semiconductor or battery, and a heat-dissipating surface.

Offering a hardness of 60 Shore 00 (ASTM D2240), the product exhibits high levels of stress relaxation, with a nearly 90% reduction in compression force after just one hour.

Parker Chomerics designed the THERM-A-GAP PAD 80LO to minimise stress on components such as integrated circuits and to provide physical protection, including vibration dampening, while maintaining effective thermal contact wherever gap conformability or rough surface texture is a concern.

Applications include GPUs, CPUs, memory modules and other high-performance computing equipment, as well as 5G and telecoms systems, the company says. Automotive sensors and devices, battery and energy storage modules, and defence electronics can also gain from the attributes of the pad.

Parker Chomerics can provide THERM-A-GAP PAD 80LO in sheets or perform die-cutting to custom sizes in thicknesses of 1-5 mm.