The Chomerics division of Parker Hannifin Corporation has launched two fully cured dispensable thermal gels. The new Therm-a-Gap Gel 35VT and 50VT conduct heat away from electronics to heat sinks or enclosures, and are said to perform reliably in both vertical and high-vibration applications.

The gels feature materials that are effective at withstanding tests involving vertical slump, high vibration and pump-out, as well as telecoms thermal verification processes.

The tackiness of the gels have the added benefit of displacing air at thin bond lines and minimising thermal impedance. It is possible to dispense them at various bond line thicknesses, typically up to 4 mm, to take up gaps created by assembly or manufacturing tolerances.

They are suitable for applications such as telecoms infrastructure, battery energy storage systems, ADAS and automotive control modules, automotive sensors and radar, and various other electronic systems in the defence, power, industrial and consumer sectors.

Gel 35VT provides a typical thermal conductivity of 3.5 W/m-K, while 50VT offers 5.2 W/m-K. Both require no mixing or secondary curing.

Gel 35VT provides electrical properties that include 200 Vac/mm dielectric strength, 10¹³ Ωcm volume resistivity (ASTM D257), 6.8 dielectric constant at 1000 kHz/0.25 mm thick (ASTM D150), and 0.022 dissipation factor at 1000 kHz/0.25 mm thick.

Based on the same tests, Gel 50VT offers the following electrical properties: 200 Vac/mm dielectric strength, 10¹⁴ Ωcm volume resistivity, 5.2 dielectric constant at 1000 kHz/0.76 mm thick, and 0.003 dissipation factor at 1000 kHz/0.76 mm thick.

The RoHS-compliant materials are suitable for use in temperatures from -40 to +150 ºC (35VT) and -55 to +200 ºC (50VT). Both are available in syringe, cartridge and pail containers, offering standard fill volumes from 10 to 2500 cc.